XRing O3 unveiled – flagship processor for Xiaomi devices

Xiaomi has expanded its line of proprietary processors with three new models. Xring O3 is designed for flagship smartphones and tablets, Xring O100 will handle local AI tasks, and Xring D100 is developed for intelligent driving systems.

The company is gradually transforming Xring from a mobile project into a full-fledged hardware platform for smartphones, cars, robots, and other devices. Xiaomi has already spent more than 21 billion yuan, approximately $3,1 billion, on developing its own chips, and the division’s team consists of nearly 3,000 specialists.

Xring O3

The main new product is the 3nm Xring O3. The chip features 24 billion transistors across an area of 133 mm². Compared to the previous Xring O1, the number of transistors increased by 26%.

The processor uses a 10-core CPU with six high-performance and four performance cores. The maximum frequency reaches 4.35 ГГц. Xiaomi claims a performance boost of CPU up to 60%.

Graphics are handled by the new 16-core G2-Ultra NX accelerator. Its performance increased by 85%, and power consumption decreased by 64%. GPU supports third-generation ray tracing.

The total cache memory of the Xring O3 is 60 MB. On CPU there are 12 MB of L2, 16 MB of L3, and another 16 MB of system SLC cache. The remaining 16 MB are used by GPU and NPU.

In AnTuTu, the new processor scored 5,228,014 points. Xiaomi calls it the first mobile chip to surpass the 5 million point mark. The test was conducted under laboratory conditions at reduced temperatures, so the results should not be directly compared with those of mass-market smartphones.

Xring O3 became the first Xiaomi mobile processor with LPDDR6 support. Memory bandwidth reaches 113.8 GB/s, which is 48% higher than that of the Xring O1.

For AI, computations with performance up to 200 TOPS for tensor operations and 3.13 TFLOPS for vector operations are provided. Performance of NPU increased by 45%. Separate AI accelerators are also built into CPU, GPU, ISP, DPU and the audio processor.

The GPU now features eight NX neural accelerators with a combined power of 36 TOPS. They enable AI-based image upscaling and intermediate frame generation directly on the graphics processing unit. Xiaomi claims the ability to simultaneously output games at resolutions up to 3.2K with a frame rate of 120 frames per second.

Development of the Xring O3 took 459 days. Serial production has already begun. The first smartphone with the new processor will be the foldable Xiaomi 18 Fold, and the chip will also be used in the Xiaomi Pad 9 Pro Max tablet. Both models are expected to be unveiled in China in September.

Xring O100

Xring O100 is specifically designed to run large language models directly on devices. Instead of the conventional scheme with separate compute blocks and memory, Xiaomi used a vertical 3D layout.

The chip is manufactured using a 6-nm process and employs Wafer on Wafer technology. Two wafers with high-speed DRAM and a wafer with NPU are stacked on top of each other and connected using Hybrid Bonding.

The distance between connection points is only 1.4 μm, and their total count reaches 2.58 million. This design allowed increasing the memory bandwidth to 1.22 TБ/s. This is approximately 16 times higher than the LPDDR5X metric in modern flagship smartphones.

Xring O100 received 14 compute blocks NPU. Paired with Xring O3, the platform can process local AI models at speeds up to 330 tokens per second.

Xiaomi has already demonstrated a prototype device with two processors, where O3 handles main tasks and O100 takes over large language model computations. In the future, such a combination may be used in smartphones, cars, and robots.

Commercial use of the Xring O100 will begin in 2027.

Xring D100

Xring D100 is designed for cars and intelligent driving systems. Xiaomi calls it the first high-performance automotive AI processor developed in China, manufactured using a 3nm process.

The chip is equipped with a 20-core CPU and a 16-core NPU. It supports up to 160 GB of combined memory and is capable of running AI models with up to 200 billion parameters locally.

Xiaomi has not yet disclosed the D100’s performance in TOPS and has not named the first vehicle to receive the new processor. Chip development and testing are already complete, with commercial use scheduled for 2027.

Currently, Xiaomi vehicles primarily use NVIDIA Thor computing platforms, while earlier models were equipped with NVIDIA Orin. Transitioning to a proprietary processor will allow the company to more deeply integrate the hardware with the software of the autonomous driving system.

Xiaomi is less dependent on third-party manufacturers

The first flagship Xring O1 processor was released by the company in May 2025. Since then, cumulative shipments of devices based on Xiaomi’s own chips have exceeded 1 million units.

The new Xring O3 will continue to be manufactured by TSMC using the 3nm process. According to Reuters, Xiaomi plans to deliver between 200,000 and 300,000 units of the upcoming Xiaomi 18 Fold.

Proprietary processors are gradually allowing Xiaomi to reduce its dependence on Qualcomm, MediaTek, and NVIDIA in key device categories. Now the company is simultaneously developing computing platforms for smartphones, local AI, and vehicles.